Publications HAL de Ahmed Sabry Eltaher,AHMED

Communication dans un congrès

2024

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Ahmed Sabry Eltaher Ahmed, Bahaeddine Ben Hamed, Rémi Perrin, Guillaume Regnat, Guillaume Lefevre, et al.. Thermal coupling assessment for a PCB-based package with embedded chips and graphite heat spreader. Conference on Integrated Power Systems (CIPS 2024), VDE, Mar 2024, Dusseldorf, Germany. ⟨hal-04534372⟩
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https://hal.science/hal-04534372/file/a107-ahmed%20final.pdf BibTex
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Bahaeddine Ben Hamed, Ahmed Sabry Eltaher Ahmed, Guillaume Lefevre, Rémi Perrin, Guillaume Regnat, et al.. Automatic Generation of Thermal Models for PCB-based Power Electronics. Conference on Integrated Power Systems (CIPS 2024), VDE, Mar 2024, Dusseldorf, Germany. ⟨hal-04534359⟩
Accès au texte intégral et bibtex
https://hal.science/hal-04534359/file/a85-ben_hamed%20final.pdf BibTex

2023

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Ahmed Sabry Eltaher Ahmed, Rémi Perrin, Guillaume Lefevre, Cyril Buttay, Jacques Jay. Graphite Heat Spreader Embedded in a PCB Package for Improved SiC Die RthJC. 2023 IEEE Energy Conversion Congress and Exposition (ECCE), Oct 2023, Nashville, United States. pp.5543-5550, ⟨10.1109/ECCE53617.2023.10362229⟩. ⟨hal-04567191⟩
Accès au texte intégral et bibtex
https://hal.science/hal-04567191/file/ECCE2023_Full_Paper_submitted.pdf BibTex
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Ahmed Sabry Eltaher Ahmed, Rémi Perrin, Guillaume Lefebvre, Cyril Buttay, Jacques Jay. Improvement of the thermal performance of printed circuit boards by embedding of graphite heat spreaders. 16th European Advanced Technology Workshop on Micropackaging and Thermal management (THERMAL 2023), IMAPS, Mar 2023, Poitiers, France. ⟨hal-04147426⟩
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2022

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Ahmed Sabry Eltaher Ahmed, Rémi Perrin, Guillaume Lefebvre, Cyril Buttay, Jacques Jay. Graphite heat spreader for power component embedded in printed circuit boards (PCB). Journée technique IEEE Electronics Packaging Society France, Chapitre français de l'IEEE Electronics Packaging Society, Dec 2022, Palaiseau, France. ⟨hal-04159893⟩
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Cyril Buttay, Bahaeddine Ben Hamed, Ahmed Sabry Eltaher Ahmed, Guillaume Regnat, Rémi Perrin. Modelling and Simulation of PCB Embedded Power Electronic Layouts. ECPE Workshop "Embedding and Advanced Integration Technologies in Power Electronics", ECPE - European Center for Power Electronics, Nov 2022, Graz, Austria. ⟨hal-04147105⟩
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Thèse

2024

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Ahmed Sabry Eltaher Ahmed. High-performance cooling of power semiconductor devices embedded in a printed circuit board. Micro and nanotechnologies/Microelectronics. INSA de Lyon, 2024. English. ⟨NNT : 2024ISAL0100⟩. ⟨tel-04931124⟩
Accès au texte intégral et bibtex
https://theses.hal.science/tel-04931124/file/these.pdf BibTex