Communication dans un congrès
2022
- ref_biblio
- Arthur Boutry, Bruno Lefebvre, Cyril Buttay, Eric Vagnon, Dominique Planson, et al.. Design of a test package for high voltage SiC diodes. Proceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨hal-03772006⟩
- Accès au texte intégral et bibtex
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- ref_biblio
- Arthur Boutry, Cyril Buttay, Besar Asllani, Bruno Lefebvre, Eric Vagnon, et al.. Experimental study of the reduction and removal of turn-on snubber for IGCT based MMC submodule using fast silicon diodes. Proceedings of the European Power Electronics conference (EPE ECCE 2022), Sep 2022, Hannovre, Germany. ⟨hal-03775977⟩
- Accès au texte intégral et bibtex
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2020
- ref_biblio
- Arthur Boutry, Cyril Buttay, Dong Dong, Rolando Burgos, Bruno Lefebvre, et al.. Figures-of-Merit and current metric for the comparison of IGCTs and IGBTs in Modular Multilevel Converters. EPE’20 ECCE Europe, Sep 2020, Lyon, France. ⟨10.23919/EPE20ECCEEurope43536.2020.9215711⟩. ⟨hal-02968851⟩
- Accès au texte intégral et bibtex
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