2013
Conference papers
- titre
- Novel low temperature 3D wafer stacking technology for high density device integration
- auteur
- I. Radu, G. Gaudin, W. van den Daele, F. Letertre, C. Mazure, L. Di Cioccio, T. Lacave, F. Mazen, P. Scheiblin, T. Signamarcheix, S. Cristoloveanu
- article
- 43rd ESSDERC, Sep 2013, Bucarest, Romania. pp.151-154, ⟨10.1109/ESSDERC.2013.6818841⟩
- Accès au bibtex
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