Publications HAL de rémy,Caillaud de la collection AMPERE

Article dans une revue

2019

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Rémy Caillaud, Cyril Buttay, Roberto Mrad, Johan Le Lesle, Florent Morel, et al.. Thermal Considerations of a Power Converter with Components Embedded in Printed Circuit Boards. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019, 10 (2), ⟨10.1109/TCPMT.2019.2939969⟩. ⟨hal-02291493⟩
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https://hal.science/hal-02291493/file/RCL_ReviewPaper_V1.pdf BibTex

Communication dans un congrès

2019

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Cyril Buttay, Christian Martin, Charles Joubert, Hervé Morel, Bruno Allard, et al.. Benefits of GaN transistors and embedding in PCB laminates. SIA Power Train & Electronics, Jun 2019, Paris, France. ⟨hal-02291496⟩
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https://hal.science/hal-02291496/file/APE2019_GaN-Embedding_Ampere-lab_v4.pdf BibTex
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Johan Le Lesle, Corentin Darbas, Florent Morel, Nicolas Degrenne, Rémy Caillaud, et al.. A 3D Folded Power Inductor with PCB based technology for applications in the kW range. APEC, Mar 2019, Anaheim, Californie, United States. ⟨10.1109/APEC.2019.8722295⟩. ⟨hal-02076182⟩
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https://hal.science/hal-02076182/file/181119_APEC19_final.pdf BibTex
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Rémy Caillaud, Johan Le Lesle, Cyril Buttay, Florent Morel, Roberto Mrad, et al.. Evaluation of the PCB-embedding technology for a 3.3 kW converter. IEEE IWIPP, Apr 2019, Toulouse, France. ⟨10.1109/IWIPP.2019.8799080⟩. ⟨hal-02291502⟩
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https://hal.science/hal-02291502/file/IWIPP_paper.pdf BibTex
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Rémy Caillaud, Johan Le Lesle, Cyril Buttay, Florent Morel, Roberto Mrad, et al.. Application of the PCB-Embedding Technology to a 3.3 kW Power Factor Corrector. APEC, Mar 2019, Anaheim, Californie, United States. ⟨hal-02076184⟩
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2018

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Johan Le Lesle, Rémy Caillaud, Florent Morel, Nicolas Degrenne, Cyril Buttay, et al.. Optimisation of an Integrated Bidirectional Interleaved Single-Phase Power Factor Corrector. PCIM Europe 2018, Jun 2018, Nuremberg, Germany. ⟨hal-01844988⟩
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https://hal.science/hal-01844988/file/180322_PCIM18_Final_version_Johan_LE_LESLE.pdf BibTex
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Rémy Caillaud, Johan Le Lesle, Cyril Buttay, Florent Morel, Roberto Mrad, et al.. Design of a 3kW power converter using PCB-embedding technology. From Nano to Micro Power Electronics And Packaging Workshop (IMAPS), Nov 2018, Tours, France. ⟨hal-01935157⟩
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Cyril Buttay, Christian Martin, Florent Morel, Rémy Caillaud, Johan Le Leslé, et al.. Application of the PCB-Embedding Technology in Power Electronics – State of the Art and Proposed Development. 3D-PEIM, Jun 2018, College Park, Maryland, United States. ⟨10.1109/3DPEIM.2018.8525236⟩. ⟨hal-01844981⟩
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https://hal.science/hal-01844981/file/3DPEIM_final.pdf BibTex
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Johan Le Lesle, Rémy Caillaud, Cyril Buttay, Florent Morel, Nicolas Degrenne, et al.. Optimum Design of a Single-Phase Power Pulsating Buffer (PPB) with PCB-integrated Inductor Technologies. 2018 IEEE ICIT, Feb 2018, Lyon, France. ⟨10.1109/ICIT.2018.8352277⟩. ⟨hal-01736332⟩
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https://hal.science/hal-01736332/file/PID5168435.pdf BibTex
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Rémy Caillaud, Cyril Buttay, Roberto Mrad, Johan Le Lesle, Florent Morel, et al.. Design, manufacturing and characterization of printed circuit board embedded inductors for power applications. 2018 IEEE ICIT, Feb 2018, Lyon, France. ⟨10.1109/ICIT.2018.8352262⟩. ⟨hal-01736336⟩
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https://hal.science/hal-01736336/file/PID5170239_PdfCheck.pdf BibTex

2017

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Rémy Caillaud, Cyril Buttay, Johan Le Lesle, Florent Morel, Roberto Mrad, et al.. High power PCB-embedded inductors based on ferrite powder. 5th Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum (MiNaPAD 2017, IMAPS, May 2017, Grenoble, France. ⟨hal-01535727⟩
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Rémy Caillaud, Cyril Buttay, Roberto Mrad, Johan Le Lesle, Florent Morel, et al.. Comparison of planar and Toroidal PCB integrated inductors for a multi-cellular 3.3 kW PFC. 2017 IEEE IWIPP, Apr 2017, Delft, Netherlands. ⟨10.1109/IWIPP.2017.7936757⟩. ⟨hal-01535721⟩
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https://hal.science/hal-01535721/file/ID1019_RCL_IWIPP_Paper_V2_PdfChecked.pdf BibTex
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Johan Le Lesle, Rémy Caillaud, Florent Morel, Nicolas Degrenne, Cyril Buttay, et al.. Multi-objective optimisation of a bidirectional single-phase grid connected AC/DC converter (PFC) with two different modulation principles. ECCE, Oct 2017, Cincinnati, OH, United States. ⟨10.1109/ECCE.2017.8096889⟩. ⟨hal-01644174⟩
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Thèse

2019

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Rémy Caillaud. Integration of a 3.3 kW, AC/DC bidirectional converter using printed circuit board embedding technology. Electronics. Université de Lyon, 2019. English. ⟨NNT : 2019LYSEI001⟩. ⟨tel-02124524⟩
Accès au texte intégral et bibtex
https://theses.hal.science/tel-02124524/file/these.pdf BibTex