Publications HAL de la collection Ampere

2022

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Amin Salim Obaid Al-Hinaai, Till Huesgen, Cyril Buttay, Richard Zeitler, Daniela Mayer. A novel integrated cooling packaging for high power density semiconductors. 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2022), Sep 2022, Dublin, Ireland. ⟨hal-03803773⟩
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https://hal.science/hal-03803773/file/therminic_amin.pdf BibTex
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Somya Anand, Eric Vagnon, Martin Guillet, Cyril Buttay. Assessment of Partial Discharge Phenomenon in AC and Fast-rising Square Voltage Using Optical Detection Technique in Needle-Plane Configuration With Pressboard in Mineral Oil. 2022 IEEE 21st International Conference on Dielectric Liquids (ICDL), May 2022, Sevilla, Spain. pp.1-4, ⟨10.1109/ICDL49583.2022.9830959⟩. ⟨hal-03803771⟩
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https://hal.science/hal-03803771/file/IEEE%20ICDL2022_final.pdf BibTex
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Arthur Boutry, Bruno Lefebvre, Cyril Buttay, Eric Vagnon, Dominique Planson, et al.. Design of a test package for high voltage SiC diodes. Proceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨hal-03772006⟩
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https://hal.science/hal-03772006/file/IWIPP_2022_papier_Arthur.pdf BibTex
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Pierre Le Métayer, Cyril Buttay, Drazen Dujic, Piotr Dworakowski. Medium Voltage Diode Rectifier Design for High Step-Up DC-DC Converter. European Power Electronics conference (EPE ECCE 2022), Sep 2022, Hannovre, Germany. ⟨hal-03790420⟩
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https://hal.science/hal-03790420/file/2022132635.pdf BibTex
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Mickaël Petit, Cyril Buttay. Intégration hybride en électronique de puissance. Journée Electronique de Puissance, Mar 2022, Grenoble, France. ⟨hal-03712244⟩
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Bahaeddine Ben Hamed, Guillaume Regnat, Guillaume Lefèvre, Cyril Buttay. Automatic Model Generation for PCB-based Power Electronics. Conference on Integrated Power Electronics Systems (CIPS), Mar 2022, Berlin, Germany. ⟨hal-03641121⟩
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https://hal.science/hal-03641121/file/CIPS22_bahaeddine.pdf BibTex
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Hugo Reynes, Eric Vagnon, Cyril Buttay, Martin Guillet. Enhancing voltage rating of standard power modules for harsh environment applications. Proceedings of the Power Conversion Intelligent Motion conference (PCIM) 2022, May 2022, Nuremberg, Germany. ⟨hal-03760089⟩
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https://hal.science/hal-03760089/file/PCIM_2022_REYNES.pdf BibTex
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Piotr Dworakowski, Pierre Le Métayer, Drazen Dujic, Cyril Buttay. Unidirectional step-up isolated DC-DC converter for MVDC electrical networks. CIGRE Session 2022, Aug 2022, Paris, France. ⟨hal-03771023⟩
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https://hal.science/hal-03771023/file/B4PS2-Dworakowski-Unidirectional%20step-up%20isolated%20DC-DC%20converter%20for%20MVDC%20electrical%20networks%20v11%20-%20HAL.pdf BibTex
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Amin Salim Obaid Al-Hinaai, Till Huesgen, Cyril Buttay, Eric Vagnon, Richard Zeitler, et al.. A Novel Packaging with Direct Dielectric Liquid Cooling for High Voltage Power Electronics. Proceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨hal-03772005⟩
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https://hal.science/hal-03772005/file/Amin_s_IWIPP_paper.pdf BibTex
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Arthur Boutry, Cyril Buttay, Besar Asllani, Bruno Lefebvre, Eric Vagnon, et al.. Experimental study of the reduction and removal of turn-on snubber for IGCT based MMC submodule using fast silicon diodes. Proceedings of the European Power Electronics conference (EPE ECCE 2022), Sep 2022, Hannovre, Germany. ⟨hal-03775977⟩
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https://hal.science/hal-03775977/file/2022125210.pdf BibTex

2021

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Jack Knoll, Mina Shawky, Sheng-Hung Yen, Ibrahim Eshera, Christina Dimarino, et al.. Characterization of 4 kV Charge-Balanced SiC MOSFETs. APEC, Jun 2021, Phoenix, AZ, United States. ⟨10.1109/APEC42165.2021.9487454⟩. ⟨hal-03360838⟩
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https://hal.science/hal-03360838/file/Knoll%20-%202021%20-%20Characterization%20of%204_5%20kV%20Charge-Balanced%20SiC%20MOSFETs.pdf BibTex
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Jian Liu, Lakshmi Ravi, Dong Dong, Rolando Burgos, Cyril Buttay, et al.. High Power Density Design of Power Electronic Interrupter in Hybrid DC Circuit Breaker. APEC, Jun 2021, Phoenix, United States. pp.33-38, ⟨10.1109/APEC42165.2021.9487241⟩. ⟨hal-03361482⟩
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https://hal.science/hal-03361482/file/High%20Power%20Density%20Design%20of%20Power%20Electronic%20Interrupter%20in%20Hybrid%20DC%20Circuit%20Breaker.pdf BibTex
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Pierre Le Métayer, Juan Paez, Sellé Touré, Cyril Buttay, Drazen Dujic, et al.. Break-even distance for MVDC electricity networks according to power loss criteria. EPE'21 ECCE Europe, Sep 2021, Ghent, Belgium. https://ieeexplore.ieee.org/document/9570416, ⟨10.23919/EPE21ECCEEurope50061.2021.9570416⟩. ⟨hal-03366134⟩
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https://hal.science/hal-03366134/file/2021123951.pdf BibTex
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Somya Anand, Eric Vagnon, Ayyoub Zouaghi, Martin Guillet, Cyril Buttay, et al.. Electrical and optical partial discharge assessment of dielectric barriers in mineral oil and synthetic ester. EIC, Jun 2021, Denver, United States. pp.602-605, ⟨10.1109/EIC49891.2021.9612267⟩. ⟨hal-03515576⟩
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https://hal.science/hal-03515576/file/ANAND_VAGNON_ZOUAGHI_et_al_2021.PDF BibTex
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Lakshmi Ravi, Jian Liu, Dong Dong, Rolando Burgos, Cyril Buttay, et al.. Surge Current Capability of IGBT Based Power Electronic Interrupter Modules for Hybrid DC Circuit Breaker Applications. IEEE Applied Power Electronics Conference and Exposition (APEC 2021), Jun 2021, Phoenix, AZ, United States. pp.395-400, ⟨10.1109/APEC42165.2021.9487086⟩. ⟨hal-03361517⟩
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https://hal.science/hal-03361517/file/Surge%20Current%20Capability%20of%20IGBT%20Based%20Power%20Electronic%20Interrupter%20Modules%20for%20Hybrid%20DC%20Circuit%20Breaker%20Applications_final.pdf BibTex

2020

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Cyril Buttay, Hiu-Yung Wong, Boyan Wang, Ming Xiao, Christina Dimarino, et al.. Surge Current Capability of Ga2O3 Schottky Diodes. CPES Annual Conference, Aug 2020, Blacksburg, VA, United States. ⟨hal-02968817⟩
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https://hal.science/hal-02968817/file/CPES_Surge_Current.pdf BibTex
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Arthur Boutry, Cyril Buttay, Dong Dong, Rolando Burgos, Bruno Lefebvre, et al.. Figures-of-Merit and current metric for the comparison of IGCTs and IGBTs in Modular Multilevel Converters. EPE’20 ECCE Europe, Sep 2020, Lyon, France. ⟨10.23919/EPE20ECCEEurope43536.2020.9215711⟩. ⟨hal-02968851⟩
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https://hal.science/hal-02968851/file/Version_finale_papier_EPE_2020.pdf BibTex
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Majed Eddine Moustaid, Vincent Platel, Cyril Buttay, Bruno Lefebvre. Thermosiphon for passive cooling of a MVDC converter iMaps-ATW on Micropackaging and Thermal Management. 15th European Advanced Technology Workshop on Micropackaging and Thermal Management, Feb 2020, La Rochelle, France. ⟨hal-02968778⟩
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Nicolas Mary, Rémi Perrin, Stefan Mollov, Cyril Buttay. Simple and Precise Calorimetry Method for Evaluation of Losses in Power Electronic Converters. CIPS 2020, Mar 2020, Berlin, Germany. ⟨hal-02968788⟩
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https://hal.science/hal-02968788/file/Simple_and_Precise_Calorimetry_Method_for_Evaluation_of_Losses_in_Power_Electronic_Converters.pdf BibTex
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Thomas Lagier, Piotr Dworakowski, Cyril Buttay, Philippe Ladoux, Andrzej Wilk, et al.. Experimental validation and comparison of a SiC MOSFET based 100 kW 1.2 kV 20 kHz three-phase dual active bridge converter using two vector groups. EPE’20 ECCE Europe, Sep 2020, Lyon ( virtual ), France. ⟨10.23919/EPE20ECCEEurope43536.2020.9215631⟩. ⟨hal-02973471⟩
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https://hal.science/hal-02973471/file/20200625_vAF_.pdf BibTex
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Thomas Lagier, Piotr Dworakowski, Laurent Chédot, François Wallart, Bruno Lefebvre, et al.. How Good are the Design Tools in Power Electronics?. EPE’20 ECCE Europe, Sep 2020, Lyon (Virtual conference), France. ⟨10.23919/EPE20ECCEEurope43536.2020.9215942⟩. ⟨hal-02968867⟩
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https://hal.science/hal-02968867/file/bare_jrnl.pdf BibTex

2019

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Cyril Buttay, Christian Martin, Charles Joubert, Hervé Morel, Bruno Allard, et al.. Benefits of GaN transistors and embedding in PCB laminates. SIA Power Train & Electronics, Jun 2019, Paris, France. ⟨hal-02291496⟩
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https://hal.science/hal-02291496/file/APE2019_GaN-Embedding_Ampere-lab_v4.pdf BibTex
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Ilyas Dchar, Cyril Buttay, Hervé Morel. Packaging Solution for SiC Power Modules with a Fail-to-Short Capability. APEC, Mar 2019, Anaheim, Californie, United States. ⟨10.1109/APEC.2019.8722126⟩. ⟨hal-02076181⟩
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https://hal.science/hal-02076181/file/fail-to-shortmodule_compresse.pdf BibTex
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Pierre Demumieux, Oriol Avino-Salvado, Cyril Buttay, Christian Martin, Fabien Sixdenier, et al.. Design of a Low-Capacitance Planar Transformer for a 4 kW/500 kHz DAB Converter. APEC, Mar 2019, Anaheim, Californie, United States. pp.18720757, ⟨10.1109/APEC.2019.8722279⟩. ⟨hal-02076183⟩
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https://hal.science/hal-02076183/file/Article_final1.pdf BibTex
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Johan Le Lesle, Corentin Darbas, Florent Morel, Nicolas Degrenne, Rémy Caillaud, et al.. A 3D Folded Power Inductor with PCB based technology for applications in the kW range. APEC, Mar 2019, Anaheim, Californie, United States. ⟨10.1109/APEC.2019.8722295⟩. ⟨hal-02076182⟩
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https://hal.science/hal-02076182/file/181119_APEC19_final.pdf BibTex
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Thilini Wickramasinghe, Cyril Buttay, Christian Martin, Hervé Morel, Pascal Bevilacqua, et al.. An investigation of current distribution over four GaN HEMTs in parallel configurations. The 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA 2019), Oct 2019, Raleigh, United States. ⟨10.1109/WiPDA46397.2019.8998816⟩. ⟨hal-02405882⟩
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https://hal.science/hal-02405882/file/PID6140157.pdf BibTex
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Rémy Caillaud, Johan Le Lesle, Cyril Buttay, Florent Morel, Roberto Mrad, et al.. Evaluation of the PCB-embedding technology for a 3.3 kW converter. IEEE IWIPP, Apr 2019, Toulouse, France. ⟨10.1109/IWIPP.2019.8799080⟩. ⟨hal-02291502⟩
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https://hal.science/hal-02291502/file/IWIPP_paper.pdf BibTex
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Vincent Bley, Cyril Buttay, Denis Labrousse, Mickael Petit, Bojan Djuric, et al.. Die Interconnection for Power Module 3.0. ECPE Workshop "Power Module 2.0", Oct 2019, Hambourg, Germany. ⟨hal-02405800⟩
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Majed Eddine Moustaid, Vincent Platel, Cyril Buttay. Study of convective condensation in a thermosiphon loop. 14th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics (HEFAT 2019), Jul 2019, Wicklow, Ireland. ⟨hal-02417004⟩
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https://hal.science/hal-02417004/file/Article_HEFAT_Majed%28modifi%C3%A9%29.pdf BibTex
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Thilini Wickramasinghe, Bruno Allard, Cyril Buttay, Charles Joubert, Christian Martin, et al.. A Study on Shunt Resistor-based Current Measurements for Fast Switching GaN Devices. 45th IEEE IECON, Oct 2019, Lisbonne, Portugal. ⟨10.1109/IECON.2019.8927490⟩. ⟨hal-02405883⟩
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https://hal.science/hal-02405883/file/IECON2019_INSA_final_V2.pdf BibTex
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Rémy Caillaud, Johan Le Lesle, Cyril Buttay, Florent Morel, Roberto Mrad, et al.. Application of the PCB-Embedding Technology to a 3.3 kW Power Factor Corrector. APEC, Mar 2019, Anaheim, Californie, United States. ⟨hal-02076184⟩
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2018

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Thomas Lagier, Laurent Chédot, François Wallart, Layal Ghossein, Bruno Lefebvre, et al.. A 100 kW 1.2 kV 20 kHz DC-DC converter prototype based on the Dual Active Bridge topology. 2018 IEEE ICIT, Feb 2018, Lyon, France. ⟨10.1109/ICIT.2018.8352238⟩. ⟨hal-01747437⟩
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https://hal.science/hal-01747437/file/20171222_VF_ICIT.pdf BibTex
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Cyril Buttay, Raphaël Riva, Bruno Allard, Marie-Laure Locatelli, Vincent Bley. Packaging with double-side cooling capability for SiC devices, based on silver sintering. 44th IEEE IECON, IEEE, Oct 2018, Washington DC, United States. ⟨10.1109/IECON.2018.8591117⟩. ⟨hal-01895805⟩
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https://hal.science/hal-01895805/file/sandwich_package.pdf BibTex
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Cyril Buttay, Hugo Reynes. Packaging of 10 kV SiC MOSFETs: Trade-Off Between Electrical and Thermal Performances. International Forum on Wide Bandgap Semiconductors China (IFWS), Oct 2018, Shenzhen, China. ⟨hal-01895875⟩
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Johan Le Lesle, Rémy Caillaud, Florent Morel, Nicolas Degrenne, Cyril Buttay, et al.. Optimisation of an Integrated Bidirectional Interleaved Single-Phase Power Factor Corrector. PCIM Europe 2018, Jun 2018, Nuremberg, Germany. ⟨hal-01844988⟩
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https://hal.science/hal-01844988/file/180322_PCIM18_Final_version_Johan_LE_LESLE.pdf BibTex
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Aymen Ben Kabaar, Cyril Buttay, Olivier Dezellus, Rafael Estevez, Anthony Gravouil, et al.. Characterization of Materials and their Interfaces in a DBC Substrate for Power Electronics Applications. ECPE Workshop "Future of Simulation in Power Electronics Packaging for Thermal and Stress Management", Nov 2018, Nuremberg, Germany. ⟨hal-01935060⟩
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Majededdine Moustaid, Cyril Buttay, Vincent Platel. Design considerations for the 2-phase cooling system of a 5 MW MVDC converter. Troisième ATW Européen Micropackaging et management thermique, Jan 2018, La Rochelle, France. ⟨hal-01895892⟩
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Rémy Caillaud, Johan Le Lesle, Cyril Buttay, Florent Morel, Roberto Mrad, et al.. Design of a 3kW power converter using PCB-embedding technology. From Nano to Micro Power Electronics And Packaging Workshop (IMAPS), Nov 2018, Tours, France. ⟨hal-01935157⟩
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Maxime Semard, Christian Martin, Cyril Buttay, Charles Joubert. High-Temperature Coplanar Transformer. 2018 IEEE ICIT, A. Sari, Laboratoire Ampère, Feb 2018, Lyon, France. pp.730 - 735, ⟨10.1109/ICIT.2018.8352268⟩. ⟨hal-01736329⟩
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https://hal.science/hal-01736329/file/Article_ICIT_Maxime.pdf BibTex
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Cyril Buttay, Christian Martin, Florent Morel, Rémy Caillaud, Johan Le Leslé, et al.. Application of the PCB-Embedding Technology in Power Electronics – State of the Art and Proposed Development. 3D-PEIM, Jun 2018, College Park, Maryland, United States. ⟨10.1109/3DPEIM.2018.8525236⟩. ⟨hal-01844981⟩
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https://hal.science/hal-01844981/file/3DPEIM_final.pdf BibTex
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Thomas Lagier, Cyril Buttay, Piotr Dworakowski, Benhur Zolett. Design of a 1200 V, 100 kW Power Converter: How Good are the Design and Modelling Tools?. ECPE Workshop "The Future of Simulation in Power Electronics Packaging for Thermal and Stress Management", Nov 2018, Nuremberg, Germany. ⟨hal-01939745⟩
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Johan Le Lesle, Rémy Caillaud, Cyril Buttay, Florent Morel, Nicolas Degrenne, et al.. Optimum Design of a Single-Phase Power Pulsating Buffer (PPB) with PCB-integrated Inductor Technologies. 2018 IEEE ICIT, Feb 2018, Lyon, France. ⟨10.1109/ICIT.2018.8352277⟩. ⟨hal-01736332⟩
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https://hal.science/hal-01736332/file/PID5168435.pdf BibTex
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Rémy Caillaud, Cyril Buttay, Roberto Mrad, Johan Le Lesle, Florent Morel, et al.. Design, manufacturing and characterization of printed circuit board embedded inductors for power applications. 2018 IEEE ICIT, Feb 2018, Lyon, France. ⟨10.1109/ICIT.2018.8352262⟩. ⟨hal-01736336⟩
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https://hal.science/hal-01736336/file/PID5170239_PdfCheck.pdf BibTex

2017

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Hugo Reynes, Cyril Buttay, Hervé Morel. Protruding Ceramic Substrates for High Voltage Packaging Of Wide Bandgap Semiconductors. WiPDA, Oct 2017, Albuquerque, United States. ⟨10.1109/WiPDA.2017.8170581⟩. ⟨hal-01645029⟩
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https://hal.science/hal-01645029/file/PAPIER.pdf BibTex
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Rémy Caillaud, Cyril Buttay, Roberto Mrad, Johan Le Lesle, Florent Morel, et al.. Comparison of planar and Toroidal PCB integrated inductors for a multi-cellular 3.3 kW PFC. 2017 IEEE IWIPP, Apr 2017, Delft, Netherlands. ⟨10.1109/IWIPP.2017.7936757⟩. ⟨hal-01535721⟩
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https://hal.science/hal-01535721/file/ID1019_RCL_IWIPP_Paper_V2_PdfChecked.pdf BibTex
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Ilyas Dchar, Marion Zolkos, Cyril Buttay, Hervé Morel. Robustness of SiC MOSFET under avalanche conditions. APEC, Mar 2017, Tampa, FL, United States. pp.2263-2268, ⟨10.1109/APEC.2017.7931015⟩. ⟨hal-01535735⟩
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https://hal.science/hal-01535735/file/papier_APEC_soumis.pdf BibTex
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Rémy Caillaud, Cyril Buttay, Johan Le Lesle, Florent Morel, Roberto Mrad, et al.. High power PCB-embedded inductors based on ferrite powder. 5th Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum (MiNaPAD 2017, IMAPS, May 2017, Grenoble, France. ⟨hal-01535727⟩
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Oriol Aviño Salvado, Wissam Sabbah, Cyril Buttay, Hervé Morel, Pascal Bevilacqua. Evaluation of printed-circuit boards materials for high temperature operation. HiTEN, IMAPS, Jul 2017, Cambridge, United Kingdom. ⟨hal-01565131⟩
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https://hal.science/hal-01565131/file/article.pdf BibTex
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Johan Le Lesle, Rémy Caillaud, Florent Morel, Nicolas Degrenne, Cyril Buttay, et al.. Multi-objective optimisation of a bidirectional single-phase grid connected AC/DC converter (PFC) with two different modulation principles. ECCE, Oct 2017, Cincinnati, OH, United States. ⟨10.1109/ECCE.2017.8096889⟩. ⟨hal-01644174⟩
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Jose Maneiro, Roland Ryndzionek, Thomas Lagier, Piotr Dworakowski, Cyril Buttay. Design of a SiC based triple active bridge ceil for a multi-megawatt DC-DC converter. EPE'17 ECCE Europe, Sep 2017, Warsaw, Poland. ⟨10.23919/EPE17ECCEEurope.2017.8099005⟩. ⟨hal-01646807⟩
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https://hal.science/hal-01646807/file/EPE2017_Design%20of%20a%20SiC%20based%20Triple%20Active%20Bridge%20cell%20for%20a%20multi-megawatt%20DC-DC%20converter.pdf BibTex

2016

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Rémi Perrin, Bruno Allard, Christian Martin, Cyril Buttay. Integrated High-Temperature Isolation barrier with Coreless Transformer. 9th CIPS, Mar 2016, Nuremberg, Germany. ⟨hal-01372145⟩
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https://hal.science/hal-01372145/file/1570174283_final.pdf BibTex
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Bingyao Sun, Rolando Burgos, Dushan Boroyevich, Remi Perrin, Cyril Buttay, et al.. Two Comparison-Alternative High Temperature PCB-Embedded Transformer Designs for a 2 W Gate Driver Power Supply. ECCE, IEEE, Sep 2016, Milwaukee, WI, United States. ⟨10.1109/ECCE.2016.7855537⟩. ⟨hal-01373036⟩
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https://hal.science/hal-01373036/file/PID4342177.pdf BibTex
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Remi Perrin, Bruno Allard, Cyril Buttay, Nicolas Quentin, Wenli Zhang, et al.. 2 MHz high-density integrated power supply for gate driver in high-temperature applications. APEC, Mar 2016, Long Beach, CA, United States. ⟨10.1109/APEC.2016.7467922⟩. ⟨hal-01372141⟩
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https://hal.science/hal-01372141/file/full-paper.compressed.pdf BibTex
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Chenjiang Yu, Cyril Buttay, Eric Labouré, Vincent Bley, Céline Combettes, et al.. Comparison of topside contact layouts for power dies embedded in PCB. ESTC, IMAPS, Sep 2016, Grenoble, France. ⟨10.1109/ESTC.2016.7764707⟩. ⟨hal-01373042⟩
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https://hal.science/hal-01373042/file/article.pdf BibTex
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Chenjiang Yu, Cyril Buttay, Eric Labouré. Improving the thermal management of power GaN devices. Advanced Technology Workshop (ATW) on Thermal Management, IMAPS, Sep 2016, Los Gatos, CA, United States. ⟨hal-01373027⟩
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2015

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Chenjiang Yu, Cyril Buttay, Eric Labouré, Vincent Bley, Céline Combettes. Highly integrated power electronic converters using active devices embedded in printed-circuit board. 4th Micro/Nano-Electronics, packaging and assembling, design and manufacturing forum MiNaPAD 2015, IMAPS, Apr 2015, Grenoble, France. ⟨hal-01197043⟩
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https://hal.science/hal-01197043/file/article.pdf BibTex
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Anne-Sophie Podlejski, Arnaud Bréard, Cyril Buttay, Eliana Rondon, Florent Morel, et al.. Layout modelling to predict compliance with EMC standards of power electronic converters. EMC, Aug 2015, Dresden, Germany. pp.779-784, ⟨10.1109/ISEMC.2015.7256262⟩. ⟨hal-01188561⟩
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Cheng Chen, Denis Labrousse, Stéphane Lefebvre, Mickaël Petit, Cyril Buttay, et al.. Robustness of SiC MOSFETs in short-circuit mode. PCIM Europe 2015, May 2015, Nuremberg, Germany. ⟨hal-01196528⟩
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https://hal.science/hal-01196528/file/PCIM_Cheng_2015.pdf BibTex
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Bruno Allard, Cyril Buttay, Christian Martin, Hervé Morel. Considerations for High Temperature Power Electronics. 18th International Symposium on Power Electronics Ee2015, Oct 2015, Novi Sad, Serbia. ⟨hal-01372146⟩
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https://hal.science/hal-01372146/file/output.pdf BibTex
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Cyril Buttay, Marwan Ali, Oriol Aviño Salvado, Hervé Morel, Bruno Allard. High temperature operation of SiC transistors. Advanced Technology Workshop (ATW) on Thermal Management, IMAPS, Sep 2015, Los Gatos, CA, United States. ⟨hal-01373030⟩
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Cheng Chen, Denis Labrousse, Stéphane Lefebvre, Mickael Petit, Cyril Buttay, et al.. Study of short-circuit robustness of SiC MOSFETs, analysis of the failure modes and comparison with BJTs. ESREF, Oct 2015, Toulouse, France. pp.1708-1713. ⟨hal-01700463⟩
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Chenjiang Yu, Éric Labouré, Cyril Buttay. Thermal management of lateral GaN power devices. 2015 IEEE IWIPP, May 2015, Chicago, IL, United States. ⟨10.1109/IWIPP.2015.7295973⟩. ⟨hal-01196527⟩
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https://hal.science/hal-01196527/file/thermal_characterization_gan_full.pdf BibTex
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Cyril Buttay, Bruno Allard, Raphaël Riva. Silver sintering for power electronics integration. ICEP- IAAC, IMAPS, Apr 2015, Kyoto, Japan. ⟨10.1109/ICEP-IAAC.2015.7111076⟩. ⟨hal-01196525⟩
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https://hal.science/hal-01196525/file/silver_sintering_integration.pdf BibTex

2014

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Raphaël Riva, Cyril Buttay, Marie-Laure Locatelli, Vincent Bley, Bruno Allard. Design and Manufacturing of a Double-Side Cooled, SiC based, High Temperature Inverter Leg. HiTEC 2014, May 2014, Albuquerque, United States. pp.THA27. ⟨hal-00997365⟩
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https://hal.science/hal-00997365/file/article.pdf BibTex
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Cyril Buttay, Khalil El Falahi, Rémi Robutel, Stanislas Hascoët, Christian Martin, et al.. Integrated packaging allows for improvement in switching characteristics of silicon carbide devices. PCIM Europe 2014, May 2014, Nuremberg, Germany. 8 p. ⟨hal-00997355⟩
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https://hal.science/hal-00997355/file/article_PCIM_format.pdf BibTex
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Chen Cheng, Denis Labrousse, Stéphane Lefebvre, Hervé Morel, Cyril Buttay, et al.. Power Loss Estimation in SiC Power BJTs. PCIM Europe 2014, May 2014, Nuremberg, Germany. 8 p. ⟨hal-00997718⟩
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https://hal.science/hal-00997718/file/Power_Loss_Estimation_in_SiC_Power_BJTs_PCIM_CHEN_Cheng.pdf BibTex
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Elias Haddad, Christian Martin, Charles Joubert, Bruno Allard, Cyril Buttay, et al.. Planar, Double-Layer Magnetic Inductors for Low Power, High Frequency DC-DC Converters. 8th CIPS, Feb 2014, Nuremberg, Germany. CD (5 p.). ⟨hal-00739037⟩
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Raphaël Riva, Cyril Buttay, Rémi Perrin, Marie-Laure Locatelli, Vincent Bley, et al.. 3D Packaging Structure for High Temperature Power electronics. From Nano to Micro Power Electronics and Packaging Workshop, IMAPS France, Oct 2014, Tours, France. ⟨hal-01081697⟩
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Jean-Louis Marchesini, Pierre-Olivier Jeannin, Yvan Avenas, Leonardo Ruffeil de Oliveira, Cyril Buttay, et al.. Realization and Characterization of an IGBT Module Based on the Power Chip-on-Chip 3D Concept. ECCE, Sep 2014, Pittsburgh, PA, United States. ⟨10.1109/ECCE.2014.6954043⟩. ⟨hal-01067144⟩
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2013

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Elias Haddad, Christian Martin, Cyril Buttay, Charles Joubert, Bruno Allard, et al.. High Temperature, High Frequency Micro-Inductors for Low Power DC-DC Converters. EPE, Sep 2013, Lille, France. paper 390, ⟨10.1109/EPE.2013.6631994⟩. ⟨hal-00874475⟩
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https://hal.science/hal-00874475/file/micro_inductance_EPE2013_fullpaper.pdf BibTex
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Bassem Mouawad, D. Fabregue, Cyril Buttay, Maher Soueidan. Full densification of molybdenum powders and multilayer materials obtained by Spark Plasma Sintering. ISIEM 2013, Society of Inorganic Materials, Japan (SIMJ) et Université Rennes 1, France (UR1)., Oct 2013, Rennes, France. ⟨hal-01081684⟩
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https://hal.science/hal-01081684/file/Bassem%20et%20al-ISIEM2013-v1.pdf BibTex
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Rémy Ouaida, Cyril Buttay, Raphaël Riva, Dominique Bergogne, Christophe Raynaud, et al.. Thermal stability of SiC JFETs in conduction mode. EPE, Sep 2013, Lille, France. paper 223, ⟨10.1109/EPE.2013.6631881⟩. ⟨hal-00874471⟩
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Khalil El Falahi, Stanislas Hascoët, Cyril Buttay, Pascal Bevilacqua, Luong Viet Phung, et al.. High temperature, Smart Power Module for aircraft actuators. HiTEN'13, Jul 2013, Oxford, United Kingdom. ⟨hal-00874666⟩
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https://hal.science/hal-00874666/file/article.pdf BibTex
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Fabien Dubois, Dominique Bergogne, Dominique Tournier, Cyril Buttay, Régis Meuret, et al.. Analysis of the SiC VJFET gate punch-through and its dependence with the temperature. EPE, Sep 2013, Lille, France. Paper 344, ⟨10.1109/EPE.2013.6631963⟩. ⟨hal-00874655⟩
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https://hal.science/hal-00874655/file/eEPE_punch-through_full-paper.pdf BibTex
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Xavier Fonteneau, Florent Morel, Cyril Buttay, Hervé Morel, Philippe Lahaye. Predicting Static Losses in an Inverter-Leg built with SiC Normally-Off JFETs and SiC diodes. APEC, Mar 2013, Long Beach, CA, United States. pp.2636-2642, ⟨10.1109/APEC.2013.6520668⟩. ⟨hal-00829353⟩
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https://hal.science/hal-00829353/file/2013_conf_inter_APEC_Predicting.pdf BibTex
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Cyril Buttay. High Temperature Operation of SiC Converters. ECPE SiC and GaN user forum, May 2013, Munich, Germany. ⟨hal-00874751⟩
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2012

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Christian Martin, Rémi Robutel, Cyril Buttay, Fabien Sixdenier, Pascal Bevilacqua, et al.. High Temperature Ageing of Fe-based Nanocrystalline Ribbons. HiTEC 2012, May 2012, Albuquerque, United States. 6p. ⟨hal-00760373⟩
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Stanislas Hascoët, Cyril Buttay, Dominique Planson, Rodica Chiriac, Amandine Masson. Pressureless Silver Sintering Die-Attach for SiC Power Devices. CSCRM, Sep 2012, Saint-Pétersbourg, Russia. 2p. ⟨hal-00759987v2⟩
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https://hal.science/hal-00759987/file/synopsys_hascoet-2.pdf BibTex
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Bassem Mouawad, Cyril Buttay, Maher Soueidan, Hervé Morel, Bruno Allard, et al.. 3-Dimensional, Solder-Free Interconnect Technology for high-Performance Power Modules. 7th CIPS, Mar 2012, Nuremberg, Germany. pp.433-438. ⟨hal-00707741⟩
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https://hal.science/hal-00707741/file/Mouawad_et_al-papier-soumis.pdf BibTex
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Khalil El Falahi, Fabien Dubois, Dominique Bergogne, Luong Viet Phung, Cyril Buttay, et al.. High temperature anti short circuit function for normally-on SiC JFET in an inverter leg configuration. HiTEC 2012, May 2012, Albuquerque, United States. 6p. ⟨hal-00760372⟩
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Bassem Mouawad, Cyril Buttay, Maher Soueidan, Hervé Morel, Vincent Bley, et al.. Sintered molybdenum for a metallized ceramic substrate packaging for the wide-bandgap devices and high temperature applications. ISPSD, Jun 2012, Bruges, Belgium. pp.295-298, ⟨10.1109/ISPSD.2012.6229081⟩. ⟨hal-00707820⟩
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https://hal.science/hal-00707820/file/mouawad_et_al-v4.pdf BibTex
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Dominique Bergogne, Fabien Dubois, Christian Martin, Khalil El Falahi, Luong Viet Phung, et al.. An Airborne High Temperature SiC Power Converter for Medium Power Smart Electro Mechanical Actuators. HiTEC 2012, May 2012, Albuquerque, United States. 6p. ⟨hal-00760366⟩
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Wissam Sabbah, Raphaël Riva, Stanislas Hascoët, Cyril Buttay, Stephane Azzopardi, et al.. Evaluation of silver-sintering die attach. 7th CIPS, Mar 2012, Nuremberg, Germany. pp.237-243. ⟨hal-00707733⟩
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https://hal.science/hal-00707733/file/CIPS2012_Final_Paper_apres_review_v14_.pdf BibTex
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Amandine Masson, Wissam Sabbah, Raphaël Riva, Cyril Buttay, Stephane Azzopardi, et al.. Report de puce par frittage d'argent - mise en oeuvre et analyse. 14ème EPF, Jul 2012, Bordeaux, France. pp.CD (ref 61). ⟨hal-00729156⟩
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Rémy Ouaida, Cyril Buttay, Anh Dung Hoang, Raphaël Riva, Dominique Bergogne, et al.. Thermal Runaway Robustness of SiC VJFETs. CSCRM, Sep 2012, Saint-Pétersbourg, Russia. 2p. ⟨hal-00759975v2⟩
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https://hal.science/hal-00759975/file/synopsis_remy-1.pdf BibTex

2011

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Fabien Dubois, Damien Risaletto, Dominique Bergogne, Hervé Morel, Cyril Buttay, et al.. Active protections for normally-on SiC JFETs. EPE, Aug 2011, Birmingham, United Kingdom. pp.CD. ⟨hal-00629227⟩
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Amandine Masson, Cyril Buttay, Hervé Morel, Christophe Raynaud, Stanislas Hascoët, et al.. High-temperature die-attaches for SiC power devices. EPE, Aug 2011, Birmingham, United Kingdom. pp.Article number 6020161. ⟨hal-00672602⟩
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Hervé Morel, Youness Hamieh, Dominique Tournier, Rémi Robutel, Fabien Dubois, et al.. A multi-physics model of the VJFET with a lateral channel. EPE, Aug 2011, Birmingham, United Kingdom. pp.CD. ⟨hal-00629220⟩
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Elias Haddad, Christian Martin, Charles Joubert, Bruno Allard, Maher Soueidan, et al.. Modeling, Fabrication, and Characterization of Planar Inductors on YIG Substrates. CIMA, Mar 2011, Beyrouth, Lebanon. pp.Tu-P9. ⟨hal-00787193⟩
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Bruno Allard, Cyril Buttay, Dominique Tournier, Rémi Robutel, Jean-François Mogniotte, et al.. Higher temperature power electronics for larger-scale mechatronic integration. Automotive Power Electronics, Apr 2011, Paris, France. Actes sur CD (pas de pagination). ⟨hal-00687139⟩
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https://hal.science/hal-00687139/file/APE_Full2.pdf BibTex
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D. Fabregue, Bassem Mouawad, Cyril Buttay, Maher Soueidan, Aude Lamontagne, et al.. Elaboration of Architectured Materials by Spark Plasma Sintering. THERMEC, Aug 2011, Québec, Canada. pp.1885-1892, ⟨10.4028/www.scientific.net/MSF.706-709.1885⟩. ⟨hal-00687142⟩
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https://hal.science/hal-00687142/file/Elaboration_of_architecture_materials_by_spark_plasma_sintering_soumis.pdf BibTex
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Cyril Buttay, Christophe Raynaud, Hervé Morel, Mihai Lazar, Gabriel Civrac, et al.. High-temperature behavior of SiC power diodes. EPE, Aug 2011, Birmingham, United Kingdom. pp.CD. ⟨hal-00629225⟩
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Cyril Buttay, Christophe Raynaud, Hervé Morel, Gabriel Civrac, Marie-Laure Locatelli, et al.. Thermal Requirements of SiC Power Devices. 6th European Advanced Technology Workshop on Micropackaging and Thermal Management, Feb 2011, La Rochelle, France. ⟨hal-00672631⟩
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Bassem Mouawad, Maher Soueidan, D. Fabregue, Cyril Buttay, Vincent Bley, et al.. Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering Process. CIMA, Mar 2011, Beyrouth, Lebanon. pp.CD. ⟨hal-00687147v2⟩
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https://hal.science/hal-00687147/file/Abstract_Bassem.pdf BibTex
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Cyril Buttay, Amandine Masson, Jianfeng Li, Mark C. Johnson, Mihai Lazar, et al.. Die Attach of Power Devices Using Silver Sintering - Bonding Process Optimization and Characterization. HiTEN 2011, Jul 2011, Oxford, United Kingdom. pp.1-7. ⟨hal-00672619⟩
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2010

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Rémi Robutel, Christian Martin, Hervé Morel, Cyril Buttay, Dominique Bergogne, et al.. Design of High Temperature EMI Input Filter for a 2 kW HVDC-Fed Inverter. HiTEC 2010, May 2010, Albuquerque, United States. pp.000236. ⟨hal-00485284⟩
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Cyril Buttay, Rémi Robutel, Christian Martin, Christophe Raynaud, Siméon Dampieni, et al.. Effect of High Temperature Ageing on Active and Passive Power Devices. HiTEC 2010, May 2010, Albuquerque, United States. pp.000228. ⟨hal-00485273⟩
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2009

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Dominique Bergogne, Asif Hammoud, Dominique Tournier, Cyril Buttay, Youness Amieh, et al.. Electro-thermal behaviour of a SiC JFET stressed by lightning-induced overvoltages. EPE, Sep 2009, Barcelone, France. pp.1--8. ⟨hal-00446059⟩
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https://hal.science/hal-00446059/file/Bergogne2009.pdf BibTex
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Cyril Buttay, Dominique Planson, Bruno Allard, Dominique Bergogne, Pascal Bevilacqua, et al.. State of the art of High Temperature Power Electronics. Microtherm, Jun 2009, Lodz, Poland. pp.8-17. ⟨hal-00413349⟩
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https://hal.science/hal-00413349/file/microtherm09.pdf BibTex

2005

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Hervé Morel, Bruno Allard, Sabrine M'Rad, Cyril Buttay, Kaiçar Ammous, et al.. Bond Graph Modeling of Current Diffusion in Magnetic Cores. ICBGM, Jan 2005, New Orleans, LA, United States. pp 87-91. ⟨hal-00412621⟩
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https://hal.science/hal-00412621/file/bond_graph_modelling.pdf BibTex
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Cyril Buttay, Olivier Brevet, Bruno Allard, Dominique Bergogne, Hervé Morel. Paralleling of Low-Voltage MOSFETs Operating in Avalanche Conditions. EPE, Sep 2005, Dresden, Germany. ⟨10.1109/EPE.2005.219271⟩. ⟨hal-00138894⟩
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https://hal.science/hal-00138894/file/EPE-2005_Buttay_Paralleling.pdf BibTex

2003

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Cyril Buttay, Dominique Bergogne, Hervé Morel, Bruno Allard, René Ehlinger, et al.. A Voltage-Measurement Based Estimator for Current and Temperature in MOSFET H-Bridge. EPE, Sep 2003, Toulouse, France. pp.1-10. ⟨hal-00413309⟩
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https://hal.science/hal-00413309/file/epe_papier_final.pdf BibTex
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Cyril Buttay, Dominique Bergogne, Hervé Morel, Bruno Allard, René Ehlinger, et al.. Towards a Sensorless Current and Temperature Monitoring in MOSFET-Based H-Bridge. IEEE PESC, Jun 2003, Accapulco, Mexico. pp.901 - 906, ⟨10.1109/PESC.2003.1218175⟩. ⟨hal-00413325⟩
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